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CAM Additive Manufacturing Software Adds Linking Job Feature to Simplify Programming

Latest software function makes it possible to easily link multiple additive manufacturing jobs with different technology parameters and five-axis strategies for an optimized workflow.

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Source | Open Mind Technologies

Open Mind Technologies, developers of the hyperMILL CAD/CAM software suite, offers hyperMILL Additive Manufacturing for efficient hybrid processing with simultaneous additive and subtractive processing on one machine.

For greater efficiency and ease-of-use, the company has added a new “Linking Job” function to the software to simplify the programming of complex  processes. Now it is possible to effortlessly link multiple additive jobs with different technology parameters and five-axis strategies for an optimized workflow.

The “Additive Manufacturing” job features an advanced five-axis automatic tool orientation mode, enabling safe and efficient operations even in tight spaces. By analyzing the model and additive device, it accurately determines the optimal approach whether indexed or simultaneous. 

For highly complex five-axis simultaneous processing, the software enables an array of flexible options for directed energy deposition (DED) processes and wire arc additive manufacturing (WAAM). Both laser-based powder nozzle machining heads and WAAM can be controlled using hyperMILL Additive Manufacturing for selective material deposition, as well as conveniently programmed and automatically simulated for collision avoidance. Using powder bed fusion (PBF) and any necessary rework, hyperMILL supports the full potential of additive manufacturing

The software enables users to perfectly program cladding and milling together. True-to-detail additive and subtractive simulation as well as stock tracking between the individual process steps works to ensure the greatest possible reliability. Key additive applications include repair of damaged components, including molds, cladding of additional surface skins or creation of new components from a substrate. This also creates new options for combining different materials, such as when high-quality material layers need to be applied to carrier materials.

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